Wafer Test and Burn-In System Tests 15 Wafers At a Time

October 24th, 2007

The Aehr Test FOX-15 full wafer contact test and burn-in system performs parallel testing and burn-in on up to 15 wafers. As with all members of the FOX product family, the FOX-15 contacts every die on each wafer simultaneously.

“The FOX-15 system is designed for use with wafers that require test and burn-in times typically measured in hours,” said Steve Steps, senior director of wafer level burn-in and test at Aehr Test Systems. This includes wafers whose dies are used in ultra-high reliability applications, such as automotive electronics. Using burned-in die in multi-chip packages helps assure the reliability of the final product and lowers costs by increasing the yield of high-cost multi-chip packages.

FOX-15 Features Include:

• 15 Wafer Slots
• Wafer sizes from 2 inches (50.8mm) up to 300mm
• Parallel test and burn-in of 1000s of die per wafer
• Individual die power channels to isolate shorted die
• General purpose memory and logic pattern generator
• Independent test electronics per wafer
• Liquid temperature control maintains chuck temperature deg C
• Up to 1000W power dissipation per wafer

Entry Filed under: Electronics Test