
June 1st, 2006
The ESPEC TSD-100 makes adding thermal shock testing to quality assurance programs easier by reducing the lab space and power required. The overall footprint is 40% smaller, and the power required is 60% less than chambers with similar capabilities.
The TSD-100 thermal shock chamber meets MIL-STD 883 test method 1010.7 with up to 22 lbs. of samples, such as plastic IC chips. This strict test method requires monitoring temperature recovery of the worst-case product sample from -65°C to 150°C. The overall interior volume is 4 cu. ft. (100L), allowing testing of larger products and sub-assemblies, as well as large quantities of components like ICs.
The TSD-100 is only 44 inches wide, resulting in a 40% smaller footprint than the comparable ESPEC model, ETS4-2CW. The overall power consumption (full-load amps) has also been reduced by 60%. These savings benefit from the selection of Copeland brand Scroll refrigeration compressors, which have been proven in other ESPEC models. The size was further reduced by mounting the touch-screen controller on the door.
The TDS-100 has the same color touch-screen controller as other ESPEC thermal shock models, but with a new feature called STT. STT, or Specimen Temperature Trigger, actively monitors the temperature of the product and only advances the program to the next step once the product has reached the desired temperature. The STT dynamically reduces the overall testing time by adjusting the soak period according to how much product is being tested.
Other new features include:
The TSD-100 is built at ESPEC’s headquarters in Japan and will be stocked at their Michigan factory along with replacement parts. A one-year parts and labor warranty is included. Technical details and a brochure may be found on the company’s website, as well as an animated video showing how the machine moves from hot to cold.
Also on the ESPEC website is a wealth of information on environmental testing. For example, Technology Report # 17 contains the article, “Destruction mechanisms resulting from vibration load in PCB-mounted electronics.”
Entry Filed under: Environmental/Durability Test
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