
June 16th, 2006
SMT magazine is hosting a webcast describing different inspection methods for electronics assemblies on Wednesday, July 19. The webcast will last one hour and take place at 1:00 PM EDT. Here’s the description from the SMT website:
Industry experts compare the types of methods used for inspecting boards, looking specifically at four distinct times in the assembly process: pre-reflow, during placement, post reflow, and during rework. Each method has defect detection and prevention techniques and utilizes optics, software and equipment. A comparison of AOI, AXI, microscopes and video will be part of this process. The end result of learning how to inspect boards in the SMT process is increased reliability.
Presenters include:
- Jeff Bishop, Product Manager, Agilent Technologies
- Keith Rogers, Director of Laboratory Services, University of Maryland
- Dave Mixon, Laboratory Manager, EPIC Technologies
- Matthew Vandiver, X-ray Engineering Manager, Solectron
Entry Filed under: Electronics Test, Inspection/Vision Sytems
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