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Archive for the 'Electronics Test' Category

TEAMLINC Tests Connected Vehicles at MIS

Friday, August 28th, 2009

From AutoChannel.Com:
Official testing of connected vehicle technology at Michigan International Speedway has now become a reality at the Irish Hills NASCAR racetrack.
Following a January announcement by MIS, the Michigan Department of Transportation (MDOT) and Center for Automotive Research (CAR) to use MIS’ road course as a test facility for connected vehicle technology, August 24 marked […]

Posted in Electronics Test | No Comments »

Testing Strategies in Automotive Electronics

Sunday, August 2nd, 2009

ECN Asia is currently running a story on automotive test strategies. Here’s an excerpt that discusses process testing:
In terms of verifying the quality of the assembly process, the automotive industry is somewhat conservative in implementing denser technology. According to the International Electronics Manufacturing Initiative (iNEMI), the automotive industry is slower than other market niches in […]

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Integrated MEMS Test Cells Provide High-Throughput Full Final Test

Monday, July 6th, 2009

MTC400 - Mems Test CellIntegrated test cells, specifically designed for testing MEMS devices, represent a substantial innovation able to support the market of these components, whose request is exploding, driven by consumer and automotive applications.
The ATE producer SPEA, granting the increasingly pressing request from manufacturers, has developed automated test cells specific for MEMS devices, which […]

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Powering Reliability - Ensuring Automotive Quality beyond AEC Q100/101

Tuesday, June 30th, 2009

Hans-Peter Hoenes, Senior Manager for Product Line Applications, Automotive at Fairchild Semiconductors, writes:
The increasing complexity of electronic systems in modern automobiles reached a level where a paradigm shift both in design and the qualification process becomes mandatory. Releasing products according AEC-Q101, a sampling based method derived from ammunition testing in the 1940s and implemented […]

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Vehicle-Vehicle Comms Get Road Test

Friday, October 24th, 2008

A large-scale demonstration of inter-vehicle communication will take place on 22 and 23 October 2008. At the Opel proving ground in Dudenhofen near Frankfurt am Main, the new car-to-car (C2C) communication technology is demonstrated in real life. The German Aerospace Center (Deutsches Zentrum für Luft- und Raumfahrt; DLR) is one of the parties involved in […]

Posted in Electronics Test, Everything Else | No Comments »

Differential Probes Enable Nanosecond-Order High Frequency Analysis

Friday, February 1st, 2008

Denso Corporation has begun using high-voltage, differential probes to analyze nanosecond transient noise spikes in its Electronic Control Units (ECUs) for engine control.
Operational conditions and requirements for these units have become increasingly stringent in recent years. Similarly, demand for the ability to analyze higher frequencies has escalated, particularly with regard to noise immunity to […]

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Making Basic Audio Measurements

Monday, November 26th, 2007

Audio DesignLine is running a two-part article titled “Introduction to the Six Basic Audio Measurements”:

Part 1 discusses basic test setup and how to make level measurements.
Part 2 discusses the other five basic measurements, including:

frequency response,
THD+N,
phase,
crosstalk, and
signal-to-noise ratio

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Functional Test System Features Low-Cost, Small-Footprint

Tuesday, October 30th, 2007

The Agilent TS-5040 is a scalable system in a 0.75m rack designed for testing automotive body control and safety electronic modules with just enough test capabilities to minimize cost of test. The new Agilent TS-5040 automotive functional test system has the flexibility to perform RF standalone tests, such as remote keyless entry and tire pressure […]

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Wafer Test and Burn-In System Tests 15 Wafers At a Time

Wednesday, October 24th, 2007

The Aehr Test FOX-15 full wafer contact test and burn-in system performs parallel testing and burn-in on up to 15 wafers. As with all members of the FOX product family, the FOX-15 contacts every die on each wafer simultaneously.
“The FOX-15 system is designed for use with wafers that require test and burn-in times typically measured […]

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TNI-Software and Ayrton Technology Merge to Form Geensys

Saturday, September 15th, 2007

TNI Software and Ayrton Technology, two software development companies in the automotive industry have merged to form Geensys. Geensys will offer a range of embedded development products and services for the transportation industries, including model-driven development and requirements-centric system engineering tools.
The most recent product is AUTOSAR Builder, an Eclipse-based software development platform that provides a […]

Posted in Electronics Test, Powertrain Test | No Comments »


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